PART |
Description |
Maker |
M6MGE13VW66CWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
M6MGB64BM34CWG-P M6MGT64BM34CWG-P |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
M6MGD13VW66CWG-P |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
MFN5- QRDM-CSP01 |
Flip Chip CSP DIODE
|
Formosa MS
|
M6MGD13TW34DWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP) 134,217,728-BIT (8,388,608-WORD BY 16-BIT) CMOS FLASH MEMORY & 33,554,432-BIT (2,097,152-WORD BY 16-BIT) CMOS MOBILE RAM
|
Renesas Electronics Corporation
|
M6MGD13TW66CWG-P |
134,217,728-BIT (8,388,608-WORD BY 16-BIT) CMOS FLASH MEMORY & 67,108,864-BIT (4,194,304-WORD BY 16-BIT) CMOS MOBILE RAM 134217728位(8388608字由16位)的CMOS闪存 134,217,728-BIT (8,388,608-WORD BY 16-BIT) CMOS FLASH MEMORY & 67,108,864-BIT (4,194,304-WORD BY 16-BIT) CMOS MOBILE RAM Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas Electronics, Corp. Renesas Electronics Corporation
|
TC74HC240AFWI TC74HC241AFI TC74HC244AFI TC74HC244A |
OCTAL BUS BUFFER NON INVERTED, 3-STATE OUTPUTS OCTAL BUS BUFFER INVERTED, 3-STATE OUTPUTS Low Capacitance 8 Line EMI Filter with ESD Protection; Package: DFN16 4.0x1.6x0.9mm, 0.5p, 2 extra test leads; No of Pins: 16; Container: Tape and Reel; Qty per Container: 4000 8 Line EMI Filter with ESD Protection 1.6 x 4.0 mm DFN Package; Package: DFN16 4.0x1.6x0.9mm, 0.5p, 2 extra test leads; No of Pins: 16; Container: Tape and Reel; Qty per Container: 4000 Low Capacitance 8 Line EMI Filter with ESD Protection, 1.6 x 4.0 mm DFN Package ; Package: DFN16 4.0x1.6x0.9mm, 0.5p, 2 extra test leads; No of Pins: 16; Container: Tape and Reel; Qty per Container: 4000 4 Line EMI Filter with ESD Protection DFN 1.35 x 3.0 mm Package; Package: DFN12 3.0x1.35, 0.5P; No of Pins: 12; Container: Tape and Reel; Qty per Container: 3000 Low Capacitance 6 Line EMI Filter with ESD Protection; Package: DFN12 3.0x1.35, 0.5P; No of Pins: 12; Container: Tape and Reel; Qty per Container: 3000 10 Line EMI Filter; Package: Flip-Chip-25 CSP; No of Pins: 25; Container: Tape and Reel; Qty per Container: 3000 TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC 东芝的CMOS数字集成电路硅单
|
Toshiba Semiconductor Toshiba Corporation Toshiba, Corp.
|
MM74HC273WM MM74HC273_05 MM74HC273 MM74HC273MTC MM |
Octal D-Type Flip-Flop with Clear; Package: SOP; No of Pins: 20; Container: Tape & Reel HC/UH SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO20 Octal D-Type Flip-Flops with Clear
|
Fairchild Semiconductor, Corp. FAIRCHILD[Fairchild Semiconductor]
|
WSL1506E WSL1506E10E0EBA WSL1506E10E0EEA WSL1506E1 |
Power Metal Strip㈢ Flip Chip (Extended Range) Patents Pending Power Metal Strip垄莽 Flip Chip (Extended Range) Patents Pending Power Metal Strip庐 Flip Chip (Extended Range) Patents Pending Power Metal Strip? Flip Chip (Extended Range) Patents Pending
|
Vishay Siliconix
|
CSP040605C |
CHIP SCALE LOW CAPACITANCE FLIP CHIP TVSARRAY
|
Protek Devices
|
MC74HCT273ANG |
Octal D-Type Flip-Flop; Package: 20 LEAD PDIP; No of Pins: 20; Container: Rail; Qty per Container: 18 HCT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDIP20
|
ON Semiconductor
|
5962-89841 PALCE22V10-15DMB PALCE22V10-10 PALCE22V |
3.3V / 5V ECL ÷2/4, ÷4/5/6 Clock Generation Chip; Package: SOIC-20 WB; No of Pins: 20; Container: Rail; Qty per Container: 38 Flash-erasable Reprogrammable CMOS PAL Device FLASH PLD, 15 ns, CDFP24 Flash-erasable Reprogrammable CMOS PAL Device FLASH PLD, 10 ns, CDIP24 Flash-erasable Reprogrammable CMOS PAL Device FLASH PLD, 10 ns, CDFP24 3.3V / 5V ECL Quad D Flip Flop with Set, Reset, and Differential Clock; Package: 32 LEAD LQFP 7x7, 0.8P; No of Pins: 32; Container: Tape and Reel; Qty per Container: 2000 3.3V / 5V ECL ÷2/4, ÷4/5/6 Clock Generation Chip; Package: TSSOP 20 LEAD; No of Pins: 20; Container: Rail; Qty per Container: 75 3.3V / 5V ECL ÷2/4, ÷4/5/6 Clock Generation Chip; Package: SOIC-20 WB; No of Pins: 20; Container: Rail; Qty per Container: 38
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Ecliptek, Corp. Cypress Semiconductor, Corp. Cypress Semiconductor Corp. CYPRESS[Cypress Semiconductor]
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